发明名称 CIRCUIT BOARD INSPECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To calculate error from the reference position of a probe, without causing increase in device cost. SOLUTION: A processing part performs an error calculation processing where, while making a needle tip 6a of a first probe of a first inspection head move in a region between line-symmetric conductor patterns 21 and 22 along the X axis and alternately bringing a needle tip 7a of a second probe of a second inspection head into contact with the conductor patterns 21 and 22, specifying the position of the first inspection head, at which a capacitance C1 measured when the needle tip 7a of the second probe comes into contact with the first conductor pattern 21 and a capacitance C2 measured, when the needle tip 7a of the second probe is in contact with the second conductor pattern 22 are equal to each other, by measuring the capacitances between the probes, and calculating an error Δx1 along the X direction of the specified position and a predetermined reference position A on a correction substrate 3; and a correction processing of correcting the positions of the inspection heads, when the needle tips 6a, 7a of the probes are brought into contact with the respective inspection points with the calculated error Δx1. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010071800(A) 申请公布日期 2010.04.02
申请号 JP20080239569 申请日期 2008.09.18
申请人 HIOKI EE CORP 发明人 TOMOI TADASHI
分类号 G01R31/02;G01R31/28;H05K3/00 主分类号 G01R31/02
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