| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent low yield caused by contact failure between a wiring substrate and other electric components. <P>SOLUTION: A method of manufacturing an electronic component includes the steps of: mounting a bump formation material on a first wiring substrate 100; melting the bump formation material to form a bump 200 at the first wiring substrate 100; and pressing a jig onto the formed bump 200 to form a recessed portion 220 whose portion is contact with a bump front end portion which occupies a predetermined area including a front end 202 of the bump 200. <P>COPYRIGHT: (C)2010,JPO&INPIT |
