| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermally conductive member which has superior heat conductivity and adhesive strength, and to provide a microprocessor and electronic equipment equipped with the thermally conductive member. <P>SOLUTION: In the microprocessor 1 including a CPU 3, a heat spreader 5 disposed opposite the CPU 3, and a first thermally conductive member 4 interposed between the CPU 3 and heat spreader 5, the first thermally conductive member 4 is made of an inorganic-polymer composite having a hydrophilic inorganic compound of 1 to 1,000 nm in maximum length unevenly distributed on a surface of a polymer particle of 0.05 to 100μm in volume-basis median diameter. The organic-polymer composite forming the first thermally conductive member 4 has the hydrophilic inorganic compound unevenly distributed on the surface of the polymer particle. Consequently, the microprocessor 1 having the first thermally conductive member 4 efficiently dissipates heat generated by the CPU 3 to the heat spreader 5 by the first thermally conductive member 4 to efficiently dissipate the heat. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
