发明名称 POLYAMIDE RESIN
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin having excellent processability, high heat-resistance, low water-absorption property, chemical-resistance, excellent mechanical performance, and the like. SOLUTION: In the polyamide resin, 70 mol% or more of a structural unit derived from a diamine component is derived from para-xylylenediamine, and 70 mol% or more of a structural unit derived from a dicarboxylic acid component is derived from a 6-18C aliphatic dicarboxylic acid. In the polyamide resin, a fusion calorific value in measurement of a differential scanning calorimeter (DSC) is 60 J/g or higher, a glass transition point (Tg) is 333-363 K (60-90°C), and a ratio of the glass transition point (Tg) to a melting point (Tm) satisfies (formula 1): 0.600≤(Tg/Tm)≤0.650, wherein Tg and Tm are each an absolute temperature (K). COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010070637(A) 申请公布日期 2010.04.02
申请号 JP20080239364 申请日期 2008.09.18
申请人 MITSUBISHI GAS CHEMICAL CO INC 发明人 KANDA TOMOMICHI;KUWABARA HISAMASA;OGAWA TAKASHI;SUMINO TAKAHIKO;ISHII KENTARO
分类号 C08G69/26;C08K3/00;C08L77/06 主分类号 C08G69/26
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