| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaning a semiconductor heat-treating tool, which excellently removes contaminants and prevents surface roughening etc., of the semiconductor heat-treating tool. SOLUTION: The present invention relates to the method of cleaning the semiconductor heat-treating tool used to hold a silicon substrate when the silicon substrate is heat-treated, and made of silicon. The method uses, as a cleaning liquid, a mixed liquid of nitric acid, acetic acid, and water or a mixture of water and acetic acid, prepared such that the nitric acid is blended at a mass rate of 1 to 8%, the acetic acid is blended at a mass rate of 35 to 70%, and water or a mixture of water and acetic acid is blended at a mass rate of 30 to 60%, and includes a cleaning step of cleaning the semiconductor heat-treating tool by etching the semiconductor heat-treating tool made of silicon using the cleaning liquid. COPYRIGHT: (C)2010,JPO&INPIT
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