PEELING METHOD, PEELING METHOD OF RECODING MEDIUM, AND PEELING DEVICE

摘要

<P>PROBLEM TO BE SOLVED: To provide a peeling method preventing a resin from being unevenly applied on a surface of a substrate and preventing dust adhesion thereto in a peeling step. Ž<P>SOLUTION: In the peeling method for peeling a mold 1 having a rugged shape and the resin applied onto the substrate 2 having an area equal to or smaller than that of the mold 1 and stuck to the mold 1 from each other, the mold 1 is bent by applying pressure to the mold 1 and the resin is peeled from the mold 1 in a radial direction from an outer periphery of the substrate 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž