| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet for surface protection that is tentatively attached on a front surface of a semiconductor wafer having a circuit on the front surface when its backside is ground to protect a circuit pattern, wherein after the backside is ground and the sheet is separated from the wafer front surface, wafer surface contamination by the residue originating from the sheet is very little. SOLUTION: The sheet for surface protection is tentatively attached on a semiconductor wafer surface with a circuit formed thereon in wafer backside grinding, wherein the side of the sheet attached on the wafer is composed of resin with a probe tack value of <100 mN, and the holding time of the sheet face is 70,000 or more. COPYRIGHT: (C)2010,JPO&INPIT |
