发明名称 RESIN COMPOSITION FOR MOLD RELEASE FILM, MOLD RELEASE FILM USING THE SAME AND METHOD FOR MANUFACTURING THE MOLD RELEASE FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition for a mold release film that meets requirements for a mold release film such as mold releasability, heat resistance, shape followability, stain resistance and uniform moldability, is easily disposed of and is relatively cheap, to provide a mold release film using the resin composition and to provide a method for manufacturing the mold release film. Ž<P>SOLUTION: The resin composition for a mold release film includes a resin component composed mainly of (A) a polybutylene terephthalate resin produced by copolymerizing with a diol compound as a third component and (B) a polymethylpentene resin wherein the mass ratio of the resin (A) to the resin (B) is 100:20-100:5. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010070683(A) 申请公布日期 2010.04.02
申请号 JP20080241222 申请日期 2008.09.19
申请人 DAINIPPON PRINTING CO LTD 发明人 TAGUCHI TOMOHIRO;OSONE SATOSHI;MITA KOZO
分类号 C08L67/02;C08J5/18;C08L23/20 主分类号 C08L67/02
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