| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin encapsulating mold which can be simplified in operations and shortened in heating temperature stabilizing time. SOLUTION: This mold is for pouring a molten thermosetting resin into the cavities formed in an upper and lower molds holding a substrate therebetween to be cured, where the cavities are each made into a cassette style independently from a pod part for melting the thermosetting resin. COPYRIGHT: (C)2010,JPO&INPIT |
