| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating and developing device which can save a space and has high throughput. SOLUTION: A coating part for forming a coating film and a heating device for heating a substrate are provided to both sides of a substrate conveyance path linearly extending from the carrier block side to the side of an interface part, respectively. The heating device includes: a heating plate arranged at the back side when viewed from the substrate conveyance path; a cooling plate provided on the side of the substrate conveyance path rather than the heating plate; and an exclusive conveyance mechanism exclusive for conveying the substrate between both plates. Then, such coating blocks are provided by being vertically laminated. COPYRIGHT: (C)2010,JPO&INPIT |
