| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe apparatus capable of reducing the cost per mounting table and footprint, and of suppressing the deterioration of throughput. SOLUTION: This probe apparatus is provided with inspection sections 21A (21B) having wafer chucks 4A and 4B (4C and 4D), probe cards 6A and 6B, and an upper side image pick-up unit 5 and is also set to share the upper side image pick-up unit 5 and to overlap the moving regions of the wafer chucks 4A and 4B (4C and 4D). A wafer W is transported to the wafer chuck 4A of the inspection section 21A, the wafer chuck 4C of the inspection section 21B, the wafer chuck 4B of the inspection section 21A, and the wafer chuck 4D of the inspection section 21B in this sequence, and the image of the wafer W is picked up by the image pick-up unit 5 at one-level upper location. In this way, sharing the upper side image pick-up unit 5 can reduce the cost, and overlapping the moving regions of the wafer chucks 4A and 4B (4C and 4D) can reduce the physical size of cabinets 22a and 22b, thereby reducing the footprints. COPYRIGHT: (C)2010,JPO&INPIT
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