| 摘要 |
PROBLEM TO BE SOLVED: To improve a height measurement accuracy of a solder fillet and provide a high-reliability inspection. SOLUTION: A method for measuring the height of the solder fillet includes the steps of, while irradiating a substrate with a coaxial epi-illumination infrared light and each chromatic light of red, green, and blue, imaging the fillet 102 on the substrate with a camera having a function to separate and receive the infrared light and visible lights; setting a measurement line L along with a direction of a series of specular light image areas of each illumination light in a generated image; detecting boundary points A1 to A6 of each of the specular light image areas and a dark area on this line L; applying to the boundary points A1 to A5 of each of the specular light image areas inclination angles obtained from angles representing boundaries of respective corresponding irradiation angle ranges; relating each of the inclination angles to coordinates D1 to D5 of each of the points A1 to A5; setting an approximation curve indicating a variation of the inclination angle on the line L; and integrating the approximation curve, targeting a range corresponding to the point A1 to the point A6, and identifying a measurement value obtained by this computation as the height of the solder fillet. COPYRIGHT: (C)2010,JPO&INPIT
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