发明名称 GRINDER AND WAFER GRINDING METHOD
摘要 PROBLEM TO BE SOLVED: To perform a grinding so that the inner peripheral end of an annular reinforcing portion does not become a rugged shape when forming the reinforcing portion with an outer peripheral margin area left on a backside of the wafer. SOLUTION: A truing means 14 which truing outer peripheral-side surfaces of grinding wheels 3c and 4c provided with grindstones 3b and 4b is provided, and the outer peripheral-side surfaces of grinding wheels 3c and 4c are properly trued by the truing means 14, whereby the outer peripheral-side surfaces of grinding wheels 3c and 4c can be kept perfectly round. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010074003(A) 申请公布日期 2010.04.02
申请号 JP20080241608 申请日期 2008.09.19
申请人 DISCO ABRASIVE SYST LTD 发明人 YOSHIDA SHINJI
分类号 H01L21/304;B24B53/00 主分类号 H01L21/304
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