| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device for simply checking whether an adhesive film has been divided into individual pieces, and to provide a semiconductor device manufactured by the manufacturing method and a dicing-tape integral type adhesive sheet. SOLUTION: The method of manufacturing a semiconductor device includes a process (I) for applying the adhesive film having a thickness of not more than 50 μm and a dicing tape to a semiconductor wafer having a thickness of not more than 100 μm, and a process (II) for dividing the semiconductor wafer in the order of the processes (I) to (II), or the processes (II) to (I). The manufacturing method also includes: a process (III) for cutting and rupturing the semiconductor wafer and the adhesive film to obtain a plurality of semiconductor chips having the adhesive film divided into individual pieces; and a process (IV) for bonding the semiconductor chip having the adhesive film to a support member for mounting a semiconductor chip. The appearance of the adhesive film is allowed to differ from that of the dicing tape, or fluorescence emission is allowed to differ when irradiating the adhesive film and the dicing tape with ultraviolet rays. COPYRIGHT: (C)2010,JPO&INPIT |
