| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a continuous thermal fusion bonding/cutting device of a shrink film for battery wrapping, which stabilizes a continuous thermal fusion bonding/cutting process of a superposition part of a shrink film for shrink packaging, and heat-seals the shrink film without lowering the strength of a thermal fusion bonding part even if continuous thermal fusion bonding/cutting is executed at high speed. <P>SOLUTION: The device for continuously heat-sealing and cutting the superposition part of the shrink film includes: an ultrasonic wave oscillator 31; an anvil 4 which has an endless-track protrusion 4a for guiding the shrink film while keeping a contact with the shrink film continuously fed, and is driven in a rotating manner so that the endless-track protrusion moves in synchronization with the shrink film continuously fed; and a horn 3 which has a flat head end 3a pressed against the superposition part of the shrink film moving while keeping a contact with the protrusion of the anvil, and applies ultrasonic waves emitted from the ultrasonic wave oscillator on the superposition part of the shrink film via the flat head end. <P>COPYRIGHT: (C)2010,JPO&INPIT |
