| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame around which a high quality resin package is formed, the high quality resin package, and a method for manufacturing it. <P>SOLUTION: A pressure loss section H1 (H2) extends from a position corresponding to a corner of a resin package, and S1 (=t2×w1) is the minimum value of the opening area (t2×w1 or t1×w1) of the pressure loss section H1 (H2) perpendicular to the direction of resin flow (X axis) in the pressure loss section H1 (H2) during resin molding, while S2 is the average value of the opening areas (for example, t1×w2) of excess resin reservoirs H3 to H5 perpendicular to the direction of resin flow (Y axis) within excess resin reservoir H3 to H5 during molding. In this lead frame, S1<S2 is satisfied. <P>COPYRIGHT: (C)2010,JPO&INPIT |
