| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To perform uniform working by surely and accurately detecting variance in height of a workpiece surface, particularly in a workpiece such as a sapphire substrate. <P>SOLUTION: A working apparatus is provided with a mechanism 30 for detecting variance in height of the surface of the workpiece, which includes: an interferometer 1 which uses a light source 2 for emitting light that does not go through the workpiece W to be worked and that has a wavelength equal to or more than twice as long as the size (e.g., 2μm) of the variance in height of the surface of the workpiece, for example, a wavelength of≥10μm, and which makes use of interference of reference light and detection light; and a height measuring means 7. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
