发明名称 ILLUMINANCE SENSOR AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a means for suppressing the dispersion of sensitivity of a single-chip illuminance sensor formed on a semiconductor substrate of an SOI structure. SOLUTION: The illuminance sensor is formed on the semiconductor substrate having a silicon board, an embedded oxide film formed on the silicon board, and a silicon semiconductor layer formed on the embedded oxide film. The illuminance sensor includes a signal processing circuit formed on the silicon semiconductor layer, and a visible light sensitive element formed on the silicon board. A masking film is formed on the silicon semiconductor layer around a natural lighting portion on a light-receiving portion of the visible light sensitive element. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010073808(A) 申请公布日期 2010.04.02
申请号 JP20080238249 申请日期 2008.09.17
申请人 OKI SEMICONDUCTOR CO LTD 发明人 KAWAI YASUAKI
分类号 H01L31/10;H01L21/8234;H01L27/06;H01L27/08;H01L27/14 主分类号 H01L31/10
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