| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin mold semiconductor sensor having sensor characteristic variation smaller than the conventional art, and a method of manufacturing the sensor. <P>SOLUTION: This resin mold semiconductor sensor comprises a sensor unit (10) molded by sealing a semiconductor sensor element (3) with a first resin material (7), and a housing case (14) molded by sealing the sensor unit inside with a second resin material (13) of low adhesion to the first resin material. The housing case has void sections (8) between side surfaces (Z1 and Z2) of the sensor unit parallel or substantially parallel to a lead frame and the second resin material. <P>COPYRIGHT: (C)2010,JPO&INPIT |
