| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus capable of preventing deterioration of wettability of Al, increase of cost in using an antioxidant material for suppressing the deterioration of wettability, increase of processes for material production, and damage of a semiconductor element caused by thermal stress at cooling after connection or at temperature cycle when a Zn-Al alloy solder is used, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor apparatus is configured by a semiconductor element 4, a connected member 5, and a first connection layer that connects the semiconductor element with the connected member. The first connection layer has a configuration in which Zn-Al alloy layers 31a and 31b are provided on both sides of an Al layer 1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
