| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component packaging apparatus for rationalizing the arrangement of three stages, namely a component supply stage, a component relay stage, and a component packaging stage, and improving the efficiency of production by achieving efficient movement of a pickup head and a packaging head. <P>SOLUTION: The component packaging apparatus includes: the pickup head 5 for picking up a chip 4 from a wafer sheet holder 2; a chip relay table 6 for tentatively placing the picked chip 4; the packaging head 7 for receiving the chip 4 tentatively placed on the chip relay table 6; and a substrate support table 9 for packaging the chip 4 received by the packaging head 7 on a substrate 8. By disposing the chip relay table 6 so that it is at height between the wafer sheet holder 2 and the substrate support table 9, the travel time of the pickup head 5 and the packaging head 7 has been balanced. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
