发明名称 METHOD OF MANUFACTURING CERAMIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic component that can surely form a through hole conductor on a wall surface of a through hole. <P>SOLUTION: The present invention relates to the method of manufacturing the ceramic component having a ceramic base part and a conductor part. In a conductor charging stage, an unsintered conductor 49 to become the conductor part after sintering is charged in a first through hole 47 formed penetrating unsintered ceramic moldings 42 and 43 to become the ceramic base part after the sintering along their thickness. In a laser processing stage, a second through hole 48 is formed by removing a center part of the unsintered conductor 49 by laser irradiation. A baking stage is carried out after the unsintered ceramic moldings 41, 42, 43 are laminated, and the unsintered ceramic moldings 41, 42, 43, and the unsintered conductor 49 are baked at the same time to form the through hole conductor in the first through hole 47. Consequently, the ceramic component is manufactured. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010073712(A) 申请公布日期 2010.04.02
申请号 JP20080236002 申请日期 2008.09.16
申请人 NGK SPARK PLUG CO LTD 发明人 HASEGAWA MASAMI;MIZUNO ATSUSHI
分类号 H01L23/12;H01G4/12;H05K3/00;H05K3/40;H05K3/46 主分类号 H01L23/12
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