| 摘要 |
PROBLEM TO BE SOLVED: To prevent nonuniformity in solder application, and to carry out favorable soldering in an electronic module. SOLUTION: On a back surface of a circuit substrate 12 of an electronic module 10, back surface electrodes 18a and 18b configuring many ground electrodes 16 or function terminals 18 are formed. The back surface electrodes 18a and 18b are electrically connected in an inner layer of the circuit substrate 12 to configure one terminal (a land). Thereby, the whole terminal does not become long and thin. Since each of the back surface electrodes 18a and 18b can be shortened, nonuniformity in solder application is eliminated, and the generation of a void (airspace) at soldering can be prevented. COPYRIGHT: (C)2010,JPO&INPIT |
