SEMICONDUCTOR ELEMENT-MOUNTING PACKAGE SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

摘要

Provided is a semiconductor element-mounting package substrate, which has a large degree of freedom for a package to be combined therewith but hardly restricted on a pattern design when a PoP is constituted, in which a top package and a bottom package can be connected in high density, and which reduces a warpage and is excellent in reliability.  Also provided is a method for manufacturing the package substrate.  The package substrate comprises a cavity layer with an adhesive, which has an opening and a through hole, a base layer laminated on the cavity layer by the adhesive, a cavity portion formed by the opening, and a bottomed via formed by the through hole.  In the semiconductor package substrate and the method for fabricating the substrate, the adhesive is an elastomer material, and the bottomed via has an inner wall coated with a metal and filled thereon with an electrically conductive resin.