发明名称 A HEAT-TRANSFER STRUCTURE
摘要 An apparatus 100 comprising a first substrate 130 having a first surface 125, a second substrate 132 having a second surface 127 facing the first surface and an array 170 of metallic raised features 170 being located on the first surface, each raised feature being in contact with the first surface to the second surface, a portion of the raised features being deformed via a compressive force 305.
申请公布号 WO2009154767(A3) 申请公布日期 2010.04.01
申请号 WO2009US03651 申请日期 2009.06.18
申请人 ALCATEL-LUCENT USA INC.;KEMPERS, ROGER, SCOTT;KRISHNAN, SHANKAR;LYONS, ALAN, MICHAEL;SALAMON, TODD, RICHARD 发明人 KEMPERS, ROGER, SCOTT;KRISHNAN, SHANKAR;LYONS, ALAN, MICHAEL;SALAMON, TODD, RICHARD
分类号 B32B37/10;B32B15/01 主分类号 B32B37/10
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