| 摘要 |
PURPOSE: A solder bath using a liquid induction pump is provided to minimize an apparatus to reduce oxidized lead by reducing the amount of the oxidized lead. CONSTITUTION: A solder bath using a liquid induction pump comprises a reservoir(10), a first nozzle and a second nozzle, thrust ducts(30,46), a induction coil, and liquid induction pump(29,45). A heater is installed around the reservoir. The first and the second nozzles are separately installed on the bottom of the reservoir using a fixer in the inside of the reservoir. The thrust ducts are installed to be connected with the reservoir. The induction coil is arranged to surround the outer circumference of the thrust duct.
|
