METHOD AND APPARATUS FOR FORMING AN INTERCONNECTION THROUGH A SUBSTRATE

摘要

A method of forming an interconnection through, a substrate (11), the method comprising the steps of : forming a first via (14) through the substrate; providing a second via (13) in communication with the first via; introducing connecting material (15) into at least the second via; causing the connecting material to flow, in liquid form, from the second via to the first via under the effect of a pressure differential (e.g. as a result of a capillary- effect); and solidifying the connecting material in the first via, thereby forming an interconnection through the substrate.