发明名称 Printed Circuit Board for Harsh Environments
摘要 A printed circuit board (PCB 22) capable of withstanding ultra high G forces and ultra high temperature as in a gas turbine (11). The PCB includes a substrate having a plurality of cavities (30A, 36A) formed therein for receiving components of a circuit, and conductors embedded in the PCB for electrically connecting the components together to complete the circuit. Each of the cavities has a wall (36A′) upstream of the G-forces which supports the respective component in direct contact in order to prevent the development of tensile loads in a bonding layer (37A). When the component is an integrated circuit (50), titanium conductors (63) are coupled between exposed ends of the embedded conductors and contact pads on the integrated circuit. A gold paste (51) may be inserted into interstitial gaps between the integrated circuit and the upstream wall.
申请公布号 US2010078202(A1) 申请公布日期 2010.04.01
申请号 US20080327348 申请日期 2008.12.03
申请人 SIEMENS ENERGY, INC. 发明人 MITCHELL DAVID J.;KULKARNI ANAND A.;BURNS ANDREW J.
分类号 H05K1/00 主分类号 H05K1/00
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