发明名称 Integrated Circuit Assemblies and Methods for Encapsulating a Semiconductor Device
摘要 A seal is formed by compressing a cured layer of a composition applied on a substrate. The composition is any liquid, liquefiable, or mastic, which, after application to a surface, is converted or cured to a compressible solid film. The composition includes a flexible polymer as a binding material. The layer on the substrate eliminates the need for a gasket on a contact surface of a mold. The contact surface of the mold compresses the layer during an encapsulation process. The layer remains on the substrate in a finished product. A minimum separation or wall thickness of the mold is defined by the material properties of the mold. The seal eliminates yield loss due to leakage of an encapsulant and reduces maintenance costs associated with the procurement and repeated installation of gaskets on mold tooling.
申请公布号 US2010081237(A1) 申请公布日期 2010.04.01
申请号 US20080242111 申请日期 2008.09.30
申请人 AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD. 发明人 WONG TOM SHEAU;LIM TZE WEI;VAN HAASTEREN ADRIANUS J.P.
分类号 H01L21/00 主分类号 H01L21/00
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