发明名称 |
LAMINATED BODY, CIRCUIT BOARD INCLUDING LAMINATED BODY, SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING LAMINATED BODY |
摘要 |
There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less. |
申请公布号 |
US2010078201(A1) |
申请公布日期 |
2010.04.01 |
申请号 |
US20080523320 |
申请日期 |
2008.02.07 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
YOSHIZAKI KAZUYUKI;ITO TEPPEI;ONOZUKA IJI;NAKAMURA KENSUKE |
分类号 |
H05K1/03;B32B5/12;B32B37/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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