| 摘要 |
A method for monitoring the temperature and slope of a wafer is presented, and the steps of the method comprises: (a) providing a cooling machine, a monitoring system, a sensing module, and a wafer; (b) cooling the wafer by the cooling machine; (c) sensing all regions of the wafer by the sensing module, and detecting the temperature and slope of the wafer relative to the cooling machine; (d) if the wafer's temperature is higher than a set temperature, the monitoring system outputs a first alarm signal, if the wafer's slope is greater than a set slope, the monitoring system outputs a second alarm signal.
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