发明名称 PRINTED CIRCUIT BOARD FOR HARSH ENVIRONMENTS
摘要 A printed circuit board (PCB 22) capable of withstanding ultra high G forces and ultra high temperature as in a gas turbine (11). The PCB includes a substrate having a plurality of cavities (30A, 36A) formed therein for receiving components of a circuit, and conductors embedded in the PCB for electrically connecting the components together to complete the circuit. Each of the cavities has a wall (36A') upstream of the G-forces which supports the respective component in direct contact in order to prevent the development of tensile loads in a bonding layer (37A). When the component is an integrated circuit (50), titanium conductors (63) are coupled between exposed ends of the embedded conductors and contact pads on the integrated circuit. A gold paste (51) may be inserted into interstitial gaps between the integrated circuit and the upstream wall.
申请公布号 WO2010036496(A1) 申请公布日期 2010.04.01
申请号 WO2009US55801 申请日期 2009.09.03
申请人 SIEMENS ENERGY, INC.;MITCHELL, DAVID, J.;KULKARNI, ANAND, A.;BURNS, ANDREW, J. 发明人 MITCHELL, DAVID, J.;KULKARNI, ANAND, A.;BURNS, ANDREW, J.
分类号 H05K3/00;H01L21/48;H01L23/495;H05K7/00 主分类号 H05K3/00
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