A printed circuit board (PCB 22) capable of withstanding ultra high G forces and ultra high temperature as in a gas turbine (11). The PCB includes a substrate having a plurality of cavities (30A, 36A) formed therein for receiving components of a circuit, and conductors embedded in the PCB for electrically connecting the components together to complete the circuit. Each of the cavities has a wall (36A') upstream of the G-forces which supports the respective component in direct contact in order to prevent the development of tensile loads in a bonding layer (37A). When the component is an integrated circuit (50), titanium conductors (63) are coupled between exposed ends of the embedded conductors and contact pads on the integrated circuit. A gold paste (51) may be inserted into interstitial gaps between the integrated circuit and the upstream wall.
申请公布号
WO2010036496(A1)
申请公布日期
2010.04.01
申请号
WO2009US55801
申请日期
2009.09.03
申请人
SIEMENS ENERGY, INC.;MITCHELL, DAVID, J.;KULKARNI, ANAND, A.;BURNS, ANDREW, J.
发明人
MITCHELL, DAVID, J.;KULKARNI, ANAND, A.;BURNS, ANDREW, J.