摘要 |
Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can include embedding IC elements onto the receiving substrate upon softening the receiving substrate. Such softening can be performed by using a softening agent and/or an activatable thermal barrier material. In an exemplary embodiment, pockets can be formed in the receiving substrate using the activatable thermal barrier material for the IC assembly. |
申请人 |
EASTMAN KODAK COMPANY;KERR, ROGER, STANLEY;TREDWELL, TIMOTHY, JOHN;BAEK, SEUNG-HO |
发明人 |
KERR, ROGER, STANLEY;TREDWELL, TIMOTHY, JOHN;BAEK, SEUNG-HO |