CHEMICAL MECHANICAL POLISHING APPARATUS HAVING CONDITIONING DISK

摘要

PURPOSE: It includes diamonds having the different height and the chemical mechanical polishing machine continuously makes maintain the efficiency of the conditioning disk. The lifetime of the conditioning disk and grinding pad can be extended. CONSTITUTION: The grinding pad is attached on the platen in order to be used for the grinding of wafer. The wafer head part introduces wafer on the grinding pad. The conditioning disk(400) comprises the first and second diamonds(421, 423) successively proceed the conditioning action according to the service life. The first and second diamonds are respectively attached to the first of the disk surface and the classified second part to have the other height between the reciprocity.