发明名称 |
UNIVERSAL BUMP ARRAY STRUCTURE |
摘要 |
A bump array structure for an integrated circuit is presented. An array of metal alloy bumps is disposed on a surface of the integrated circuit. The array of metal alloy bumps is configured to receive input from a multi-layer substrate package and transmit output to the multi-layer substrate package. The array defines a first portion of metal alloy bumps around the periphery of the surface of the integrated circuit configured to provide power and ground signals for the integrated circuit. The array further defines a second portion of metal alloy bumps providing power and ground for the integrated circuit, located between opposing sides of the periphery of the integrated circuit. Metal alloy bumps not contained in either the first or the second portion of the array are configured for input and output signals between the integrated circuit and the multi-level substrate package
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申请公布号 |
US2010078207(A1) |
申请公布日期 |
2010.04.01 |
申请号 |
US20080242674 |
申请日期 |
2008.09.30 |
申请人 |
CHANG LI-TIEN;XIE YUANLIN |
发明人 |
CHANG LI-TIEN;XIE YUANLIN |
分类号 |
H01R12/30 |
主分类号 |
H01R12/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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