发明名称 |
PATTERNING BY STAMPED METAL RESIST |
摘要 |
A method is provided. A first layer is provided over a substrate, the first layer comprising a first material. A patterned second layer is applied over the first layer via stamping. The second layer comprising a second material. The second layer covers a first portion of the first layer, and does not cover a second portion of the first layer. The second portion of the first layer is removed via a subtractive process while the first portion of the first layer is protected from removal by the patterned second layer.
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申请公布号 |
US2010080914(A1) |
申请公布日期 |
2010.04.01 |
申请号 |
US20080331062 |
申请日期 |
2008.12.09 |
申请人 |
THE REGENTS OF THE UNIVERSITY OF MICHIGAN |
发明人 |
FORREST STEPHEN R.;MIHNEV MOMCHIL T.;TAYLOR ANDRE D.;XU XIN |
分类号 |
B05D1/32;B05D1/28 |
主分类号 |
B05D1/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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