| 摘要 |
An improved process for producing a piezoelectric ceramic device is disclosed, wherein the process includes the following steps: securing a metal plate in a mold cavity body by maintaining a binding area on a top surface of the metal plate, and that the top surface other than the binding area is enveloped, confined and secured; coating a metal paste on the binding area; placing a piezoelectric ceramic powder on the metal paste; pressing a pressing pillar on the piezoelectric ceramic powder; securing the pressing pillar in position; heating the mold cavity body so as to sinter the piezoelectric ceramic powder as a sintered body, and heating the mold cavity body so as to treat the sintered body to become a not-yet polarized piezoelectric ceramic sheet. Therefore, the same mold is employed for the piezoelectric ceramic powder sintering, the heat treatment, and the positioning and binding to the metal plate.
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