APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

An apparatus for mounting an electronic component is provided with: a punching apparatus (5A, 5B) which is arranged in an apparatus main body (1) and punches out a TCP from a carrier tape; a receiving/transferring means (6A, 6B) which receives and transfers the punched out TCP; an index means (18A, 18B) having a plurality of holding heads which receive and hold the transferred TCPs; an adhering apparatus (31A, 31B) which adheres the adhesive tape on the TCPs which have been transferred to the holding heads; a table apparatus which receives and aligns a substrate; and a mounting head (53) which mounts on the aligned substrate the TCP having the adhesive tape adhered thereon.  The adhering apparatus is provided with: a supplying reel (34) which winds thereon the adhesive tape having a release tape adhered thereon and is arranged at a lower section inside the apparatus main body; and a heating/pressurizing means (43) which is arranged above the supplying reel, and pressurizes and adheres on the TCP the adhesive tape, which has been fed out from the supplying reel with the release tape and cut to a predetermined length, while heating the adhesive tape.