| 摘要 |
Disclosed is a lead-free solder alloy having high reliability, which can be used for soldering an on-vehicle electronic circuit.Specifically disclosed is a lead-free solder alloy containing 2.8-4% by mass of Ag, 3-5.5% by mass of In, 0.5-1.1% by mass of Cu, additionally if necessary, 0.5-3% by mass of Bi, and the balance of Sn. In this lead-free solder alloy, In is solid-solved in at least a part of the Sn matrix. |
