发明名称 SYSTEM COMPRISING AN ELECTRICAL COMPONENT AND AN ELECTRICAL CONNECTING LEAD FOR SAID COMPONENT, AND METHOD FOR THE PRODUCTION OF SAID SYSTEM
摘要 <p>A system has at least one electrical component that is provided with at least one electrical contact surface, at least one electrical connecting lead for electrically contacting the contact surface of the component, and at least one electrical insulating layer which is disposed on the component and encompasses at least one opening. The opening is continuous in the direction of the thickness of the insulating layer and is arranged so as to lie opposite the contact surface of the component. The insulating layer is provided with a lateral surface that delimits the opening while the electrical connecting lead is provided with at least one metallization layer located on the lateral surface. The metallization layer is oriented at an angle to the contact surface such that a section of the connecting lead which is mounted on the insulating layer largely disconnects the insulating layer and the component from each other in a mechanical manner. For this purpose, the metallization layer is preferably a few mum think. The mechanical disconnection allows the connecting lead, the insulating layer, and the component to be made of materials having different thermal expansion coefficients.</p>
申请公布号 HK1104379(A1) 申请公布日期 2010.04.01
申请号 HK20070109092 申请日期 2007.08.21
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 SCHWARZBAUER, HERBERT
分类号 H01L;H01L21/60;H01L23/482;H01L23/485;H01L23/538 主分类号 H01L
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