| 摘要 |
A conductive surface 5 of a film 4 is plated with copper by allowing the film 4 to pass through a plating solution 7 in a plating bath 6 while conveying the film in a direction indicated by the arrow. Air knife devices 20A and 20B are disposed between the plating solution 7 and a next cathode roller 1B so as to face a conductive surface 5 of the film 4. The air knife devices 20A and 20B remove liquid and moisture on the conductive surface 5 by jetting heated air to the conductive surface 5 drawn out of the plating solution 7. Accordingly, even when the conductive surface 5 comes in contact with the next cathode roller 1B, developed silver is not dissolved, thereby preventing the silver contamination of the cathode rollers 1B and 1C.
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