发明名称 |
Method for forming three-dimensional structure, method for manufacturing semiconductor device, and semiconductor device |
摘要 |
A method for forming a three-dimensional structure comprises: a first step of dropping a liquid material containing a structure-forming material and a solvent onto a structure forming surface; and a second step of drying at least a part of the solvent in the dropped liquid material to form a deposit layer on the structure forming surface, wherein the first step and the second step are repeated while a dropping position of the liquid material is shifted such that a next droplet of the liquid material is dropped onto the deposit layer formed of the previously-dropped liquid material to repeatedly accumulate the deposit layers on the structure forming surface, thereby forming a three-dimensional structure having at least one inclination portion inclined with respect to the structure forming surface.
|
申请公布号 |
US2010078824(A1) |
申请公布日期 |
2010.04.01 |
申请号 |
US20090585875 |
申请日期 |
2009.09.28 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
OKAMORI KAZUAKI |
分类号 |
H01L21/768;H01L21/50;H01L23/482 |
主分类号 |
H01L21/768 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|