发明名称 MACHINED SURFACE LED ASSEMBLY
摘要 <p>A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.</p>
申请公布号 WO2010036759(A1) 申请公布日期 2010.04.01
申请号 WO2009US58156 申请日期 2009.09.24
申请人 BRIDGELUX, INC.;SHI, WEI;SHAIKEVITCH, ALEX;SOLOMENSKY, MICHAEL 发明人 SHI, WEI;SHAIKEVITCH, ALEX;SOLOMENSKY, MICHAEL
分类号 H01L33/00 主分类号 H01L33/00
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