<p>A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.</p>
申请公布号
WO2010036759(A1)
申请公布日期
2010.04.01
申请号
WO2009US58156
申请日期
2009.09.24
申请人
BRIDGELUX, INC.;SHI, WEI;SHAIKEVITCH, ALEX;SOLOMENSKY, MICHAEL