COOLING SYSTEM

摘要

The present invention relates to a cooling system for cooling hot electronic components (2) in computing centers, comprising a heat receiving structure (6) having one end in direct contact with the electronic component (2) for conducting the heat from said electronic component (2) and having another end in direct contact with a confined cooling channel (8) adapted for receiving said heat and having a flow there through, wherein the confined cooling channel (8) comprises an inlet side (20) and an outlet side (18), which are connected to the outside of the computing center. By connecting the inlet (20) and the outlet (18) of the cooling channel (8) to the exterior of the room the heat generated from the hot electronic components is separated from the ambient air in the computing center room, which dramatically reduces the need for air conditioning and facilitates the recuperating of the energy produced by the electronic components.