发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE |
摘要 |
An integrated circuit package system includes: providing a mountable structure having a contact pad and an inner pad; mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and connecting the linear through channel exposed on the integrated circuit device second side to the inner pad.
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申请公布号 |
US2010078828(A1) |
申请公布日期 |
2010.04.01 |
申请号 |
US20080239774 |
申请日期 |
2008.09.27 |
申请人 |
HUANG RUI;CHOW SENG GUAN;KUAN HEAP HOE |
发明人 |
HUANG RUI;CHOW SENG GUAN;KUAN HEAP HOE |
分类号 |
H01L23/48;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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