LEADFRAME SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE

摘要

Provided are a leadframe substrate, which can be manufactured without generating failures, such as bending and curving of wiring, and ensures reliability to heat stress, a method for manufacturing such leadframe substrate, and a semiconductor device.  On a first surface of a metal board, a semiconductor element mounting section and a semiconductor element electrode connecting terminal are formed, on a second surface, an external connecting terminal is formed, and wiring and a resin layer which connect the semiconductor element electrode connecting terminal and the external connecting terminal are provided.  On the bottom surface of a hole section, which is partially formed on the second surface of the metal board without penetrating the metal board, a plurality of protruding sections protruding in the direction to be away from the metal plate are formed by being separately scattered with a height lower than the position of the second surface without having a current flowing between the protruding sections and the wiring.