发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, LIGHTING APPARTUS, DISPLAY ELEMENT AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 An LED array chip (2), which is one type of a semiconductor light emitting device, includes an array of LEDs (6), a base substrate (4) supporting the array of the LEDs (6), and a phosphor film (48). The array of LEDs (6) is formed by dividing a multilayer epitaxial structure including a light emitting layer into a plurality of portions. The phosphor film (48) covers an upper surface of the array of the LEDs (6) and a part of every side surface of the array of LEDs (6). Here, the part extends from the upper surface to the light emitting layer.
申请公布号 US2010078657(A1) 申请公布日期 2010.04.01
申请号 US20090615600 申请日期 2009.11.10
申请人 发明人 NAGAI HIDEO
分类号 H01L33/00;F21K7/00;H01L27/15;H01L33/10;H01L33/38;H01L33/50 主分类号 H01L33/00
代理机构 代理人
主权项
地址