METHOD FOR FORMING WIRING AND APPARATUS FOR FORMING WIRING

摘要

The present invention aims to form a high-precision conductive layer in a short time, while surely preventing deterioration in ejection accuracy of ink droplets.  Specifically, a conductive layer (12) is formed on a surface (11a) of a substrate (11) by using an electrostatic ink as an ink I and ejecting ink droplets R of the ink I from a print head (2) by applying a voltage between the print head (2) and the substrate (11) while heating the surface (11a) of the substrate (11) to a temperature not less than the lowest boiling temperature among the boiling temperatures of main solvents contained in the ink I.