发明名称 MIIM DIODES HAVING STACKED STRUCTURE
摘要 <p>A metal-insulator diode is disclosed. In one aspect, the metal-insulator diode comprises first and second electrode and first and second insulators arranged as follows. An insulating region has a trench formed therein. The trench has a bottom and side walls. The first electrode, which comprises a first metal, is on the side walls and over the bottom of the trench. A first insulator has a first interface with the first electrode. At least a portion of the first insulator is within the trench. A second insulator has a second interface with the first insulator. At least a portion of the second insulator is within the trench. The second electrode, which comprises a second metal, is in contact with the second insulator. The second electrode at least partially fills the trench. A memory element can further be in contact with one of the electrodes, preferably also within the trench.</p>
申请公布号 WO2010036616(A1) 申请公布日期 2010.04.01
申请号 WO2009US57696 申请日期 2009.09.21
申请人 SANDISK 3D LLC;SEKAR, DEEPAK, C.;KUMAR, TANMAY;RABKIN, PETER;PING, ER-XUAN;CHEN, XIYING 发明人 SEKAR, DEEPAK, C.;KUMAR, TANMAY;RABKIN, PETER;PING, ER-XUAN;CHEN, XIYING
分类号 H01L45/00;H01L27/24 主分类号 H01L45/00
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