发明名称 SOLDER BATH WITH LIQUID INDUCTION PUMP
摘要 <p>The present invention discloses a solder bath using a liquid induction pump so as to prevent the pulsation of molten solder and supply molten solder in the form of a stable wave. The solder bath comprises a storage tank around which heaters are installed; a first nozzle and a second nozzle which are installed at a location raised to a predetermined height from the floor of the storage tank by fixing means arranged in the storage tank; and liquid induction pumps having thrust ducts installed so as to communicate with the storage tank, induction coils placed so as to enclose the outer circumference of the thrust ducts, and internal iron cores installed in separation from the inner wall of the thrust duct to be connected to the first nozzle and second nozzle respectively.</p>
申请公布号 WO2010035926(A1) 申请公布日期 2010.04.01
申请号 WO2009KR00287 申请日期 2009.01.20
申请人 TS CO., LTD.;LIM, SEUNG SOO 发明人 LIM, SEUNG SOO
分类号 B23K3/06 主分类号 B23K3/06
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